Large-Format Metrology System Debuts to Over $5 Million in Orders
BILLERICA, Mass.--(BUSINESS WIRE)--
Bruker Corporation (NASDAQ: BRKR) today announced that it has launched
the ContourSP
large panel metrology system, which more than doubles the
measurement throughput of the high-density interconnect (HDI) substrates
in multi-chip modules (MCM) over previous generation SP models used by
the semiconductor packaging industry. Specifically designed to measure
each layer of the printed circuit board (PCB) panels during
manufacturing, the gage-capable ContourSP assures the
minimum recipe development time, highest yield, maximum up-time, and
lowest cost per measured panel in production. These features have
already led to over $5 million in orders by several leading HDI/MCM PCB
manufacturers.
Bruker's ContourSP 3D Optical Microscope for the Printed Circuit Board Industry (Photo: Business Wire)
“Demand for Bruker’s fifth generation SP model continues to build as
early adoption customers enjoy the advanced capabilities and ease of use
offered by the ContourSP,” said
Mark R. Munch
, Ph.D.,
President of the Bruker MAT Group. “By doubling the throughput and
adding new proprietary measurement capabilities, our customers are able
to achieve maximum productivity in this era of ever smaller line widths
and tighter tolerances in the PCB industry.”
“Not only is the ContourSP much faster than other systems
at performing these precise measurements, but we have added a number of
productivity enhancing features,” added
Kent Heath
, Senior Director of
Marketing for Bruker’s Stylus and Optical Business. “The new Vision64®
operator interface with multi-processing features multi-region analysis,
automatic re-measurement, and our proprietary Dynamic Signal
Segmentation (DSS) analysis, making the ContourSP the most
comprehensive tool available.”
About ContourSP
Based on white light interferometry,
the ContourSP incorporates decades of packaging and panel
measurement experience to provide unprecedented speed, metrology
capability, reliability, serviceability, and manufacturing readiness for
3D critical dimension measurements in MCM and HDI PCB applications.
Bruker’s high-performance 3D optical microscopes feature Vision64
operating and analysis software, and the industry's most intuitive,
modular user interface to deliver user-level-customization capabilities
for the widest possible range of surface profiling metrology
applications. The ContourSP also utilizes Bruker’s
revolutionary gantry-based design and integrated workstation to support
up to 600x600-millimeter samples in a highly compact footprint.
About Bruker Corporation (NASDAQ: BRKR)
Bruker is a leading
provider of high-performance scientific instruments and solutions for
molecular and materials research, as well as for diagnostics, industrial
and applied analysis. For more information, please visit www.bruker.com.
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Source: Bruker Corporation