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Bruker Announces $10M in New Orders for Novel Metrology Tools from Leading Semiconductor Manufacturer

May 12, 2011

SANTA BARBARA, Calif. & MADISON, Wis., May 12, 2011 (BUSINESS WIRE) -- Bruker today announces new order bookings for multiple Bruker tools from a leading global semiconductor foundry, totaling over $10 million. Bruker is providing a variety of high-performance semiconductor metrology systems, ranging from fully automated InSight(TM)3D atomic force microscopes, D8 FABLINE(TM) and D8 DISCOVER(TM) X-ray diffraction systems to S2 PICOFOX(TM) portable bench-top TXRF spectrometers. This combination of industry-leading metrology technology and front- to back-end fab flexibility brings many R&D and QC benefits to nanoelectronics manufacturers, as the industry pursues sub-32 nanometer capabilities.

"These recent orders are a validation of the synergy we anticipated with our inclusion in the Bruker family," said Dean Dawson, Sr. Director for Product Line Management of Bruker's AFM business. "We are pleased that the InSight3D-AFM is continuing its acceptance in semiconductor fabs. With its accurate, inline, three-dimensional, 22-nanometer measurement capabilities, the InSight is enabling semiconductor manufacturers to reduce their process development times for advanced technology nodes and shorten their time to market."

"This is an opportunity for Bruker to support the semiconductor industry's increasing adoption of X-ray metrology as a crucial technology for present and future technology nodes," added Assunta Vigliante, Ph.D., Bruker AXS Head of Business Development for the Semiconductor Industry. "Bruker's D8 products pinpoint device failures, while providing important lab-to-fab X-ray metrology capabilities to address advanced semiconductor process control and new materials characterization."

About InSight 3DAFM

The InSight 3DAFM provides non-destructive, high-resolution three-dimensional measurements of critical 32-nanometer semiconductor features to determine CD, sidewall angle, and line width roughness on critical layers, including Gate and FinFet structures. The system contains a high-precision X-Y stage with superior accuracy and a unique pattern recognition system with high-precision laser auto-focus capability. In addition, new AFM control techniques and proprietary probe designs enable improved precision, lower cost per measurement site, and smaller feature measurements. Finally, system reliability is significantly enhanced to meet the demands of 45nm and below production-based metrology.


The D8 FABLINE provides fully automated handling of 300mm wafers under Class 1 clean room conditions. It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes. The D8 DISCOVER is a multi-purpose X-ray diffraction platform, designed for high-performance materials research and methodology development. The system features state-of-the-art technology, including capabilities for in-plane grazing incidence diffraction (IP-GID).

About Bruker Corporation(NASDAQ: BRKR):

Bruker Corporation is a leading provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for industrial and applied analysis. For more information, please visit


Any statements contained in this press release that do not describe historical facts may constitute forward-looking statements as that term is defined in the Private Securities Litigation Reform Act of 1995. Any forward-looking statements contained herein are based on current expectations, but are subject to risks and uncertainties that could cause actual results to differ materially from those projected, including, but not limited to, risks and uncertainties relating to adverse changes in conditions in the global economy and volatility in the capital markets, the integration of businesses we have acquired or may acquire in the future, changing technologies, product development and market acceptance of our products, the cost and pricing of our products, manufacturing, competition, dependence on collaborative partners and key suppliers, capital spending and government funding policies, changes in governmental regulations, realization of anticipated benefits from economic stimulus programs, intellectual property rights, litigation, and exposure to foreign currency fluctuations and other risk factors discussed from time to time in our filings with the Securities and Exchange Commission. These and other factors are identified and described in more detail in our filings with the SEC, including, without limitation, our annual report on Form 10-K for the year ended December 31, 2010, our most recent quarterly reports on Form 10-Q and our current reports on Form 8-K. We expressly disclaim any intent or obligation to update these forward-looking statements other than as required by law.

SOURCE: Bruker Corporation

Bruker Nano Surfaces Division
Stephen Hopkins, +1 520-741-1044 x1022
Marketing Communications

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